AI/ML

Reliability, Machine Learning And Advanced Packaging – SemiEngineering

Reliability, Machine Learning And Advanced Packaging
SemiEngineering
SE: How do we improve reliability at 7/5/3nm, especially when some of these chips are expected to be in the market for 15 or more years in markets such as automotive and industrial. Goyal: We have to create time capsules. Fifteen years from now, errors

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